Method and device for selectively supplying voltage to multiple amplifiers by using switching regulator

ABSTRACT

Various embodiments disclose a method and a device including: an antenna, a switching regulator, communication chip including an amplifier and a linear regulator operably connected to the amplifier and the switching regulator, the communication chip configured to transmit a radio-frequency signal from the electronic device through the antenna, and control circuitry configured to control the communication chip such that the linear regulator provides the amplifier with a voltage corresponding to an envelope of an input signal input to the amplifier, the input signal corresponding to the radio-frequency signal.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based on and claims priority under 35 U.S.C. § 119to Korean Patent Application No. 10-2018-0129271, filed on Oct. 26,2018, in the Korean Intellectual Property Office, the disclosure ofwhich is incorporated by reference herein in its entirety.

BACKGROUND 1) Field

The disclosure relates to a method and a device for selectivelysupplying a voltage to multiple amplifiers using a switching regulator.

2) Description of Related Art

Development of wireless communication systems has been directed tosupporting higher data transmission rates in order to satisfy theever-increasing demands for wireless data traffic. In order to support ahigh data transmission rate, a wide signal bandwidth and a complicatedsignal modulation scheme are necessary, thereby increasing thepeak-to-average power ratio (PAPR). Therefore, a power amplifier thatconsumes a large amount of power inside an electronic device needs tohave high-efficiency and high-linearity characteristics.

In order to have high-efficiency and high-linearity characteristics withregard to wideband and high-PAPR signals, envelope tracking (ET)technology has been applied to fourth-generation (4G) communicationsystems. Unlike conventional amplifiers that use fixed power supplyvoltages, the ET technology applies an envelope signal of an RF inputsignal, which is applied to an amplifier (for example, an RF poweramplifier), as a power supply voltage of the amplifier, thereby reducingpower consumption. Since the ET technology adjusts the envelope signalsuch that the voltage (Vcc) applied to the amplifier tracks the envelopeof the RF signal, power dissipation is minimized, thereby enabling theamplifier to operate with a high efficiency. The amplifier generates athird-order inter modulation distortion (IMD3) during signalamplification, and the third-order inter modulation distortion may havea sweet spot point. The amplifier, if the ET technology is appliedthereto, can have higher linearity characteristics than conventionalpower amplifiers due to Vcc shaping that enables tracking the sweetspot.

Evolution of wireless communication systems from the third generation(3G) to 4G has been followed by an abrupt increase in the transmissionrate and active development of differentiated services in the mobileservice market. However, evolution of mobile communication networks hasnot stopped there, and there has been fully-fledged research on new 5Gmobile communication, such as enhanced mobile-broadband (eMBB),ultra-reliable & low latency communication (URLLC), and massivemachine-type communication (mMTC), domestically and internationally.Actual implementation of 5G mobile communication may be largely dividedinto Sub6 5G and mmWave 5G. Compared with 4G LTE signals, the Sub6 5Gand mmWave 5G have more complicated signal modulation schemes for fastersuper-high data transmission, and thus have wider bandwidths and largerPAPRs. Wider signal bandwidths make it difficult to develop modulatorsthat are capable of tracking, but there is an increasing demand for theET technology because transmitting signals having large PAPRs furtherdecrease the efficiency of the RF power amplifier. For this reason,developers of RF system chipset solutions and ET modulators are focusingon developing wideband ET modulators such that the ET technology can beapplied to 5G.

The above information is presented as background information only toassist with an understanding of the disclosure. No determination hasbeen made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the disclosure.

SUMMARY

Embodiments of the disclosure may disclose a method and a device whereina linear regulator of an envelope tracking (ET) modulator is included ina transmission circuitry such that ET technology can be applied tosignals having wide bandwidths without any and/or decreased limitationon the distance between the ET modulator and the transmission circuitry.

An electronic device according to various example embodiments mayinclude: an antenna, a switching regulator, communication chip includingan amplifier and a linear regulator operably connected to the amplifierand the switching regulator, the communication chip configured totransmit a radio-frequency signal from the electronic device through theantenna, and control circuitry configured to control the communicationchip such that the linear regulator provides the amplifier with avoltage corresponding to an envelope of an input signal input to theamplifier, the input signal corresponding to the radio-frequency signal.

An electronic device according to various example embodiments mayinclude: an antenna, a switching regulator, an amplifier operablyconnected to the switching regulator, a linear regulator operablyconnected to the switching regulator and the amplifier, and an envelopetracking digital-analog converter (ET DAC) configured to control thelinear regulator to provide the amplifier with a voltage correspondingto an envelope of an input signal input to the amplifier, the inputsignal corresponding to a radio-frequency signal to be transmittedthrough the antenna, wherein a first electric path between the switchingregulator and the linear regulator is longer than a second electric pathbetween the linear regulator and the amplifier.

A communication chip for mounting on a circuit board of an electronicdevice to amplify a radio-frequency signal to be transmitted or receivedthrough an antenna of the electronic device according to various exampleembodiments may include: an amplifier, and a linear regulator configuredto control a switching regulator of the electronic device to provide theamplifier with a voltage corresponding to an envelope of an input signalinput to the amplifier, the input signal corresponding to aradio-frequency signal to be transmitted through the antenna.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and advantages of certainembodiments of the present disclosure will be more apparent from thefollowing detailed description, taken in conjunction with theaccompanying drawings, in which:

FIG. 1 is a block diagram illustrating an example electronic device in anetwork environment according to various embodiments;

FIG. 2 is a block diagram illustrating an example electronic device forsupporting legacy network communication and 5G network communicationaccording to various embodiments;

FIG. 3 is a block diagram illustrating an example configuration of anelectronic device having an ET modulator applied to a transmissioncircuitry according to various embodiments;

FIG. 4A is a diagram illustrating an example configuration of an ETmodulator according to various embodiments;

FIG. 4B is a diagram illustrating an example configuration of an ETmodulator according to various embodiments;

FIG. 4C is a diagram illustrating an example configuration of an ETmodulator according to various embodiments;

FIG. 5 is a diagram illustrating an example current graph of an ETmodulator according to various embodiments;

FIG. 6A is a diagram illustrating an example configuration of anelectronic device having an ET modulator applied thereto according to anexample embodiment;

FIG. 6B is a diagram illustrating an example configuration of anelectronic device having an ET modulator applied to a transmissioncircuitry according to various embodiments;

FIG. 7 is a diagram illustrating an example voltage measurement graphobtained by simulating an ET modulator according to various embodiments;

FIG. 8 is a diagram illustrating an example configuration of anelectronic device including a transmission circuitry having an ETmodulator applied thereto according to various embodiments;

FIG. 9 is a diagram illustrating an example configuration of anelectronic device including a transmission circuitry having an ETmodulator applied thereto according to various embodiments;

FIG. 10 is a diagram illustrating an example configuration of anelectronic device including a transmission circuitry having an ETmodulator applied thereto according to various embodiments; and

FIG. 11 is a flowchart illustrating an example method for operating anelectronic device according to various embodiments.

DETAILED DESCRIPTION

The electronic device according to various embodiments may be one ofvarious types of electronic devices. The electronic devices may include,for example, and without limitation, a portable communication device(e.g., a smart phone), a computer device, a portable multimedia device,a portable medical device, a camera, a wearable device, a homeappliance, or the like. According to an embodiment of the disclosure,the electronic devices are not limited to those described above.

It should be appreciated that various embodiments of the presentdisclosure and the terms used therein are not intended to limit thetechnological features set forth herein to particular embodiments andinclude various changes, equivalents, or replacements for acorresponding embodiment. With regard to the description of thedrawings, similar reference numerals may be used to refer to similar orrelated elements. It is to be understood that a singular form of a nouncorresponding to an item may include one or more of the things, unlessthe relevant context clearly indicates otherwise. As used herein, eachof such phrases as “A or B,” “at least one of A and B,” “at least one ofA or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least oneof A, B, or C,” may include all possible combinations of the itemsenumerated together in a corresponding one of the phrases. As usedherein, such terms as “1st” and “2nd,” or “first” and “second” may beused to simply distinguish a corresponding component from another, anddoes not limit the components in other aspect (e.g., importance ororder). It is to be understood that if an element (e.g., a firstelement) is referred to, with or without the term “operatively” or“communicatively”, as “coupled with,” “coupled to,” “connected with,” or“connected to” another element (e.g., a second element), the element maybe coupled with the other element directly (e.g., wiredly), wirelessly,or via a third element.

As used herein, the term “module” may include a unit implemented inhardware, software, or firmware, or any combinations thereof and mayinterchangeably be used with other terms, for example, “logic,” “logicblock,” “part,” or “circuitry”. A module may be a single integralcomponent, or a minimum unit or part thereof, adapted to perform one ormore functions. For example, according to an embodiment, the module maybe implemented in a form of an application-specific integrated circuit(ASIC).

FIG. 1 is a block diagram illustrating an electronic device 101 in anetwork environment 100 according to various embodiments.

Referring to FIG. 1, the electronic device 101 in the networkenvironment 100 may communicate with an electronic device 102 via afirst network 198 (e.g., a short-range wireless communication network),or an electronic device 104 or a server 108 via a second network 199(e.g., a long-range wireless communication network). According to anembodiment, the electronic device 101 may communicate with theelectronic device 104 via the server 108. According to an embodiment,the electronic device 101 may include a processor 120, memory 130, aninput device 150, a sound output device 155, a display device 160, anaudio module 170, a sensor module 176, an interface 177, a haptic module179, a camera module 180, a power management module 188, a battery 189,a communication module 190, a subscriber identification module (SIM)196, or an antenna module 197. In some embodiments, at least one (e.g.,the display device 160 or the camera module 180) of the components maybe omitted from the electronic device 101, or one or more othercomponents may be added in the electronic device 101. In someembodiments, some of the components may be implemented as singleintegrated circuitry. For example, the sensor module 176 (e.g., afingerprint sensor, an iris sensor, or an illuminance sensor) may beimplemented as embedded in the display device 160 (e.g., a display).

The processor 120 may execute, for example, software (e.g., a program140) to control at least one other component (e.g., a hardware orsoftware component) of the electronic device 101 coupled with theprocessor 120, and may perform various data processing or computation.According to an example embodiment, as at least part of the dataprocessing or computation, the processor 120 may load a command or datareceived from another component (e.g., the sensor module 176 or thecommunication module 190) in volatile memory 132, process the command orthe data stored in the volatile memory 132, and store resulting data innon-volatile memory 134. According to an embodiment, the processor 120may include a main processor 121 (e.g., a central processing unit (CPU)or an application processor (AP)), and an auxiliary processor 123 (e.g.,a graphics processing unit (GPU), an image signal processor (ISP), asensor hub processor, or a communication processor (CP)) that isoperable independently from, or in conjunction with, the main processor121. Additionally or alternatively, the auxiliary processor 123 may beadapted to consume less power than the main processor 121, or to bespecific to a specified function. The auxiliary processor 123 may beimplemented as separate from, or as part of the main processor 121.

The auxiliary processor 123 may control at least some of functions orstates related to at least one component (e.g., the display device 160,the sensor module 176, or the communication module 190) among thecomponents of the electronic device 101, instead of the main processor121 while the main processor 121 is in an inactive (e.g., sleep) state,or together with the main processor 121 while the main processor 121 isin an active state (e.g., executing an application). According to anembodiment, the auxiliary processor 123 (e.g., an image signal processoror a communication processor) may be implemented as part of anothercomponent (e.g., the camera module 180 or the communication module 190)functionally related to the auxiliary processor 123.

The memory 130 may store various data used by at least one component(e.g., the processor 120 or the sensor module 176) of the electronicdevice 101. The various data may include, for example, software (e.g.,the program 140) and input data or output data for a command relatedthereto. The memory 130 may include the volatile memory 132 or thenon-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and mayinclude, for example, an operating system (OS) 142, middleware 144, oran application 146.

The input device 150 may receive a command or data to be used by othercomponent (e.g., the processor 120) of the electronic device 101, fromthe outside (e.g., a user) of the electronic device 101. The inputdevice 150 may include, for example, a microphone, a mouse, or akeyboard.

The sound output device 155 may output sound signals to the outside ofthe electronic device 101. The sound output device 155 may include, forexample, a speaker or a receiver. The speaker may be used for generalpurposes, such as playing multimedia or playing record, and the receivermay be used for an incoming calls. According to an embodiment, thereceiver may be implemented as separate from, or as part of the speaker.

The display device 160 may visually provide information to the outside(e.g., a user) of the electronic device 101. The display device 160 mayinclude, for example, a display, a hologram device, or a projector andcontrol circuitry to control a corresponding one of the display,hologram device, and projector. According to an embodiment, the displaydevice 160 may include touch circuitry adapted to detect a touch, orsensor circuitry (e.g., a pressure sensor) adapted to measure theintensity of force incurred by the touch.

The audio module 170 may convert a sound into an electrical signal andvice versa. According to an embodiment, the audio module 170 may obtainthe sound via the input device 150, or output the sound via the soundoutput device 155 or a headphone of an external electronic device (e.g.,an electronic device 102) directly (e.g., wiredly) or wirelessly coupledwith the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power ortemperature) of the electronic device 101 or an environmental state(e.g., a state of a user) external to the electronic device 101, andthen generate an electrical signal or data value corresponding to thedetected state. According to an embodiment, the sensor module 176 mayinclude, for example, a gesture sensor, a gyro sensor, an atmosphericpressure sensor, a magnetic sensor, an acceleration sensor, a gripsensor, a proximity sensor, a color sensor, an infrared (IR) sensor, abiometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor.

The interface 177 may support one or more specified protocols to be usedfor the electronic device 101 to be coupled with the external electronicdevice (e.g., the electronic device 102) directly (e.g., wiredly) orwirelessly. According to an embodiment, the interface 177 may include,for example, a high definition multimedia interface (HDMI), a universalserial bus (USB) interface, a secure digital (SD) card interface, or anaudio interface.

A connecting terminal 178 may include a connector via which theelectronic device 101 may be physically connected with the externalelectronic device (e.g., the electronic device 102). According to anembodiment, the connecting terminal 178 may include, for example, a HDMIconnector, a USB connector, a SD card connector, or an audio connector(e.g., a headphone connector),

The haptic module 179 may convert an electrical signal into a mechanicalstimulus (e.g., a vibration or a movement) or electrical stimulus whichmay be recognized by a user via his tactile sensation or kinestheticsensation. According to an embodiment, the haptic module 179 mayinclude, for example, a motor, a piezoelectric element, or an electricstimulator.

The camera module 180 may capture a still image or moving images.According to an embodiment, the camera module 180 may include one ormore lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to theelectronic device 101. According to an example embodiment, the powermanagement module 188 may be implemented as at least part of, forexample, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of theelectronic device 101. According to an embodiment, the battery 189 mayinclude, for example, a primary cell which is not rechargeable, asecondary cell which is rechargeable, or a fuel cell.

The communication module 190 may support establishing a direct (e.g.,wired) communication channel or a wireless communication channel betweenthe electronic device 101 and the external electronic device (e.g., theelectronic device 102, the electronic device 104, or the server 108) andperforming communication via the established communication channel. Thecommunication module 190 may include one or more communicationprocessors that are operable independently from the processor 120 (e.g.,the application processor (AP)) and supports a direct (e.g., wired)communication or a wireless communication. According to an embodiment,the communication module 190 may include a wireless communication module192 (e.g., a cellular communication module, a short-range wirelesscommunication module, or a global navigation satellite system (GNSS)communication module) or a wired communication module 194 (e.g., a localarea network (LAN) communication module or a power line communication(PLC) module). A corresponding one of these communication modules maycommunicate with the external electronic device via the first network198 (e.g., a short-range communication network, such as Bluetooth™,wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA))or the second network 199 (e.g., a long-range communication network,such as a cellular network, the Internet, or a computer network (e.g.,LAN or wide area network (WAN)). These various types of communicationmodules may be implemented as a single component (e.g., a single chip),or may be implemented as multi components (e.g., multi chips) separatefrom each other. The wireless communication module 192 may identify andauthenticate the electronic device 101 in a communication network, suchas the first network 198 or the second network 199, using subscriberinformation (e.g., international mobile subscriber identity (IMSI))stored in the subscriber identification module 196.

The antenna module 197 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device) of theelectronic device 101. According to an embodiment, the antenna module197 may include one or more antennas, and, therefrom, at least oneantenna appropriate for a communication scheme used in the communicationnetwork, such as the first network 198 or the second network 199, may beselected, for example, by the communication module 190 (e.g., thewireless communication module 192). The signal or the power may then betransmitted or received between the communication module 190 and theexternal electronic device via the selected at least one antenna.

At least some of the above-described components may be coupled mutuallyand communicate signals (e.g., commands or data) therebetween via aninter-peripheral communication scheme (e.g., a bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIPI)).

According to an embodiment, commands or data may be transmitted orreceived between the electronic device 101 and the external electronicdevice 104 via the server 108 coupled with the second network 199. Eachof the electronic devices 102 and 104 may be a device of a same type as,or a different type, from the electronic device 101. According to anembodiment, all or some of operations to be executed at the electronicdevice 101 may be executed at one or more of the external electronicdevices 102, 104, or 108. For example, if the electronic device 101should perform a function or a service automatically, or in response toa request from a user or another device, the electronic device 101,instead of, or in addition to, executing the function or the service,may request the one or more external electronic devices to perform atleast part of the function or the service. The one or more externalelectronic devices receiving the request may perform the at least partof the function or the service requested, or an additional function oran additional service related to the request, and transfer an outcome ofthe performing to the electronic device 101. The electronic device 101may provide the outcome, with or without further processing of theoutcome, as at least part of a reply to the request. To that end, acloud computing, distributed computing, or client-server computingtechnology may be used, for example.

Various embodiments as set forth herein may be implemented as software(e.g., the program 140) including one or more instructions that arestored in a storage medium (e.g., internal memory 136 or external memory138) that is readable by a machine (e.g., the electronic device 101).For example, a processor (e.g., the processor 120) of the machine (e.g.,the electronic device 101) may invoke at least one of the one or moreinstructions stored in the storage medium, and execute it, with orwithout using one or more other components under the control of theprocessor. This allows the machine to be operated to perform at leastone function according to the at least one instruction invoked. The oneor more instructions may include a code generated by a complier or acode executable by an interpreter. The machine-readable storage mediummay be provided in the form of a non-transitory storage medium. Wherein,the “non-transitory” storage medium is a tangible device, and does notinclude a signal (e.g., an electromagnetic wave), but this term does notdifferentiate between where data is semi-permanently stored in thestorage medium and where the data is temporarily stored in the storagemedium.

According to an embodiment, a method according to various embodiments ofthe disclosure may be included and provided in a computer programproduct. The computer program product may be traded as a product betweena seller and a buyer. The computer program product may be distributed inthe form of a machine-readable storage medium (e.g., compact disc readonly memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded)online via an application store (e.g., Play Store™), or between two userdevices (e.g., smart phones) directly. If distributed online, at leastpart of the computer program product may be temporarily generated or atleast temporarily stored in the machine-readable storage medium, such asmemory of the manufacturer's server, a server of the application store,or a relay server.

According to various embodiments, each component (e.g., a module or aprogram) of the above-described components may include a single entityor multiple entities. According to various embodiments, one or more ofthe above-described components may be omitted, or one or more othercomponents may be added. Alternatively or additionally, a plurality ofcomponents (e.g., modules or programs) may be integrated into a singlecomponent. In such a case, according to various embodiments, theintegrated component may still perform one or more functions of each ofthe plurality of components in the same or similar manner as they areperformed by a corresponding one of the plurality of components beforethe integration. According to various embodiments, operations performedby the module, the program, or another component may be carried outsequentially, in parallel, repeatedly, or heuristically, or one or moreof the operations may be executed in a different order or omitted, orone or more other operations may be added.

FIG. 2 is a block diagram 200 illustrating an example electronic device101 for supporting legacy network communication and 5G networkcommunication according to various embodiments.

Referring to FIG. 2, the electronic device 101 may include a firstcommunication processor (e.g., including processing circuitry) 212, asecond communication processor (e.g., including processing circuitry)214, a first radio frequency integrated circuit (RFIC) 222, a secondRFIC 224, a third RFIC 226, a fourth RFIC 228, a first radio frequencyfront end (RFFE) 232, a second RFFE 234, a first antenna module (e.g.,including at least one antenna) 242, a second antenna module (e.g.,including at least one antenna) 244, and an antenna 248. The electronicdevice 101 may further include a processor (e.g., including processingcircuitry) 120 and a memory 130.

The network 199 may include a first network (e.g., a legacy network) 292and a second network (e.g., a 5G network) 294. According to anotherembodiment, the electronic device 101 may further include at least onecomponent among the components illustrated in FIG. 1, and the network199 may further include at least one different network. According to anembodiment, the first communication processor 212, the secondcommunication processor 214, the first RFIC 222, the second RFIC 224,the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 mayform at least a part of the wireless communication module 192. Accordingto another embodiment, the fourth RFIC 228 may be omitted or included asa part of the third RFIC 226.

The first communication processor 212 may include various communicationprocessing circuitry and support establishment of a communicationchannel in a band to be used for wireless communication with the firstnetwork 292, and legacy network communication through the establishedcommunication channel. According to various embodiments, the firstnetwork may be a legacy network including, for example, and withoutlimitation, a 2G, 3G, 4G, or long term evolution (LTE) network. Thesecond communication processor 214 may support establishment of acommunication channel corresponding to a designated band (for example,about 6 GHz to about 60 GHz) among bands to be used for wirelesscommunication with the second network 294, and, for example, and withoutlimitation, 5G network communication through the establishedcommunication channel. According to various embodiments, the secondnetwork 294 may, for example, be a 5G network as referenced by thirdgeneration partnership project (3GPP). Additionally, according to anembodiment, the first communication processor 212 or the secondcommunication processor 214 may support establishment of a communicationchannel corresponding to another designated band (for example, about 6GHz or lower) among the bands to be used for wireless communication withthe second network 294, and, for example, 5G network communicationthrough the established communication channel. According to anembodiment, the first communication processor 212 and the secondcommunication processor 214 may be implemented inside a single chip or asingle package. According to various embodiments, the firstcommunication processor 212 or the second communication processor 214may, for example, be provided inside a single chip or a single packagetogether with a processor 120, an auxiliary processor 123, or acommunication module 190.

The first RFIC 222 may convert a baseband signal generated by the firstcommunication processor 212 into a radio frequency (RF) signal at about700 MHz to about 3 GHz, which may be used for the first network 292 (forexample, legacy network), during transmission. During reception, an RFsignal may be acquired from the first network 292 (for example, legacynetwork) through an antenna (for example, the first antenna module 242),and may be preprocessed through an RFFE (for example, the first RFFE232). The first RFIC 222 may convert the preprocessed RF signal into abaseband signal such that the same can be processed by the firstcommunication processor 212.

The second RFIC 224 may convert a baseband signal generated by the firstcommunication processor 212 or the second communication processor 214into an RF signal in a Sub6 band (for example, about 6 GHz or lower)(hereinafter, referred to as a 5G Sub6 RF signal) that may be used forthe second network 294 (for example, 5G network). During reception, a 5GSub6 RF signal may be acquired from the second network 294 (for example,5G network) through an antenna (for example, the second antenna module244), and may be preprocessed through an RFFE (for example, the secondRFFE 234). The second RFIC 224 may convert the preprocessed 5G Sub6 RFsignal into a baseband signal such that the same can be processed by acommunication processor corresponding to the first communicationprocessor 212 or the second communication processor 214.

The third RFIC 226 may convert a baseband signal generated by the secondcommunication processor 214 into an RF signal in a 5G Above6 band (forexample, about 6 GHz to about 60 GHz) (hereinafter, referred to as a 5GAbove6 signal) that is to be used for the second network 294 (forexample, 5G network). During reception, a 5G Above6 RF signal may beacquired from the second network 294 (for example, 5G network) throughan antenna (for example, the antenna 248), and may be preprocessedthrough the third RFFE 236. The third RFIC 226 may convert thepreprocessed 5G Above6 signal into a baseband signal such that the samecan be processed by the second communication processor 214. According toan embodiment, the third RFFE 236 may be formed as a part of the thirdRFIC 226.

According to an embodiment, the electronic device 101 may include afourth RFIC 228 separately from the third RFIC 226 or as at least a partthereof. In this example, the fourth RFIC 228 may convert a basebandsignal generated by the second communication processor 214 into an RFsignal in an intermediate frequency band (for example, about 9 GHz toabout 11 GHz) (hereinafter, referred to as an IF signal) and thendeliver the IF signal to the third RFIC 226. The third RFIC 226 mayconvert the IF signal into a 5G Above6 RF signal. During reception, a 5GAbove6 RF signal may be received from the second network 294 (forexample, 5G network) through an antenna (for example, antenna 248) andconverted into an IF signal by the third RFIC 226. The fourth RFIC 228may convert the IF signal into a baseband signal such that the same canbe processed by the second communication processor 214.

According to an embodiment, the first RIFC 222 and the second RFIC 224may, for example, be implemented as at least a part of a single chip ora single package. According to an embodiment, the first RFFE 232 and thesecond RFFE 234 may, for example, be implemented as at least a part of asingle chip or a single package. According to an embodiment, at leastone antenna module of the first antenna module 242 or the second antennamodule 244 may be omitted or coupled to another antenna module so as toprocess RF signal in multiple corresponding bands.

According to an embodiment, the third RFIC 226 and the antenna 248 maybe arranged on the same substrate so as to form a third antenna module246. For example, the wireless communication module 192 or the processor120 may be arranged on a first substrate (for example, main PCB). Inthis example, the third RFIC 226 may be formed on a partial area (forexample, lower surface) of a second substrate (for example, sub PCB)that is separate from the first substrate, and the antenna 248 may bearranged in another partial area (for example, upper surface), therebyforming a third antenna module 246. The third RFIC 226 and the antenna248 may be arranged on the same substrate such that the length of thetransmission line between the same can be reduced. This may reduce loss(for example, attenuation) of a signal in a high-frequency band (forexample, about 6 GHz to about 60 GHz) used for 5G network communication,for example, due to the transmission line. Accordingly, the electronicdevice 101 may improve the quality or speed of communication with thesecond network 294 (for example, 5G network).

According to an embodiment, the antenna 248 may, for example, include anantenna array including multiple antenna elements that may be used forbeamforming. In this example, the third RFIC 226 may include multiplephase shifters 238 corresponding to the multiple antenna elements, as apart of the third RFFE 236, for example. During transmission, each ofthe multiple phase shifters 238 may shift the phase of a 5G Above6 RFsignal, which is to be transmitted to the outside (for example, basestation of 5G network) of the electronic device 101, through acorresponding antenna element. During reception, each of the multiplephase shifters 238 may shift the phase of a 5G Above6 RF signal receivedfrom the outside into the same or substantially same phase through acorresponding antenna element. This enables transmission or receptionthrough beamforming between the electronic device 101 and the outside.

The second network 294 (for example, 5G network) may be operatedindependently of the first network 292 (for example, legacy network)(for example, standalone (SA)), or operated while being connectedthereto (for example, non-standalone (NSA)). For example, the 5G networkmay include an access network (for example, 5G radio access network(RAN) or next-generation network (NG RAN)) and may not include a corenetwork (for example, next-generation core (NGC)). In this example, theelectronic device 101 may access the access network of the 5G networkand then access an external network (for example, Internet) under thecontrol of the core network (for example, evolved packed core (EPC)) ofthe legacy network. Protocol information (for example, LTE protocolnetwork) for communication with the legacy network or protocolinformation (for example, new radio (NR) protocol information) forcommunication with the 5G network may be stored in the memory 130, andmay be accessed by another component (for example, the processor 120,the first communication processor 212, or the second communicationprocessor 214).

FIG. 3 is a block diagram illustrating an example configuration of anelectronic device having an ET modulator applied to a transmissioncircuitry according to various embodiments.

Referring to FIG. 3, the electronic device according to variousembodiments (for example, the electronic device 101 in FIG. 1) mayinclude a first transmission circuitry 310, a second transmissioncircuitry 320, a control circuitry 330, and a switching regulator 340.

The first transmission circuitry 310 (for example, the first RFFE 232 inFIG. 2) may include a first amplifier 311 and a first linear regulator313. The first transmission circuitry 310 may encode an RF signal (forexample, a first transmission signal) associated with communication (forexample, wireless communication), may modulate the same in conformitywith the transmission scheme, and may output the same. The RF signalinput to the first transmission circuitry 310 from the wirelesscommunication module (for example, the wireless communication module 192in FIG. 1 or the first communication processor 212 in FIG. 2) may havethe level of a weak signal having low-gain low-output power. Since theRF signal may have severe signal attenuation or noise, the firsttransmission circuitry 310 may amplify the power of the RF signal, whentransmitting the RF signal to a base station, and then transmit thesame, in order to improve the transmission efficiency against the signalattenuation or noise.

According to various embodiments, the first transmission circuitry 310may amplify a first transmission signal (for example, an RF inputsignal) into a signal having high gain and high output (for example, anRF output signal) using the first amplifier 311. The first amplifier 311may be configured to amplify the first transmission signal. The firstamplifier 311 may provide loading energy to a weak signal (for example,an AC signal) using a power supply (for example, fixed power supplyvoltage) from the power management module (for example, the powermanagement module 188 in FIG. 1) of the electronic device 101 so as tomake a larger AC waveform, thereby amplifying the first transmissionsignal. If the first amplifier 311 amplifies the first transmissionsignal using a fixed power supply, unnecessary power dissipation mayoccur. Since the first amplifier 311 consumes a large amount of power inthe electronic device 101, the same may need to have high-efficiency andhigh-linearity characteristics. In order for the first amplifier 311 tohave high-efficiency and high-linearity characteristics, envelopetracking (ET) technology may be applied to the first amplifier 311.

According to various embodiments, the ET technology may refer, forexample, to a technology of applying an envelope signal of an RF inputsignal, which is input to an amplifier (for example, the first amplifier311 or the second amplifier 321), as a power supply voltage of the firstamplifier 311 or the second amplifier 321, thereby reducing the powerconsumption. Since the ET technology adjusts the envelope signal suchthat the voltage (Vcc) applied to the amplifier tracks the RF envelope,power dissipation is minimized and/or reduced, thereby ensuring that theamplifier operates with a high efficiency. An ET modulator to which theET technology is applied may include a linear regulator, a comparator,or a switching regulator, and the first transmission circuitry 310 mayinclude the linear regulator (for example, first linear regulator 313)or the comparator (for example, first comparator (not illustrated))included in the ET modulator.

According to various embodiments, no comparator is separatelyillustrated in FIG. 3 but, since the first linear regulator 313 controlsthe input to the switching regulator (for example, the switchingregulator 340 in FIG. 3), it may be understood that the first linearregulator 313 may include a comparator. The first comparator may comparean input voltage with a reference voltage, may detect whether the inputexceeds the reference voltage, and may output the result as a digitalvalue (for example, 0 or 1). For example, the first comparator maycompare the output from the switching regulator 340 and the output fromthe first linear regulator 313 and may output a digital value of, forexample, 0 or 1.

According to various embodiments, the first linear regulator 313 may beconfigured to supply a first voltage to the first amplifier 311, basedon an envelope corresponding to a first designated frequency band of thefirst transmission signal. The first linear regulator 313, whichcontrols (or adjusts) a voltage, is designed to operate with a linearrelation between input and output. Since the first linear regulator 313has high-speed characteristics, the same can amplify a high-frequencysignal among envelope signals of an input signal applied to the firstamplifier 311. For example, the first linear regulator 313 may control(or adjust) the first voltage such that the first voltage applied to thefirst amplifier 311 tracks (or follows) the envelope corresponding tothe first designated frequency band. By adjusting the first voltage tocorrespond to the envelope, the first linear regulator 313 may reducepower used by the first amplifier 311 to amplify the first transmissionsignal.

According to various embodiments, the first linear regulator 313 mayregulate and thus compensate for noise generated by the switchingregulator 340. Even if a low-frequency signal from the switchingregulator 340 may be distorted by a trace (for example, a signal linethrough which a signal from the switching regulator 340 is delivered),the first linear regulator 313 regulates the same and thus generates anenvelope signal. Accordingly, an inductance resulting from the distancebetween the switching regulator 340 and the first amplifier 311 may notbe considered.

According to various embodiments, the first designated frequency bandmay be a frequency band configured in the first transmission circuitry310. For example, the first designated frequency band may be at leastone of a band of about 700 MHz to about 3 GHz used for the first network(for example, the first network 292 in FIG. 2, or a legacy network), aSub6 band (for example, about 6 GHz or lower) used for a second network(for example, the second network 294 in FIG. 2 or a 5G network), anintermediate frequency band (for example, about 9 HHz to about 11 GHz),or a 5G Above6 band (for example, about 6 HGz to 60 GHz).

The second transmission circuitry 320 (for example, the RFFE 234 in FIG.2) may include a second amplifier 321 and a second linear regulator 323.The second transmission circuitry 320 may encode an RF signal (forexample, a second transmission signal) associated with communication(for example, wireless communication), may modulate the same inconformity with the transmission scheme, and may output the same. The RFsignal input to the second transmission circuitry 320 from the wirelesscommunication module 192 (for example, the first communication processor212 or the second communication processor 214 in FIG. 2) may have thelevel of a weak signal having low-gain low-output power. The secondtransmission circuitry 320 may amplify the second transmission signal(for example, an RF input signal) into a signal having high gain andhigh output (for example, an RF output signal) using the secondamplifier 321. The second amplifier 321 may be configured to amplify thesecond transmission signal. The second amplifier 321 may load energy toa weak signal (for example, an AC signal) by applying a power supply(for example, fixed power supply voltage) from the power managementmodule (for example, the power management module 188 in FIG. 1) of theelectronic device 101 such that a larger AC waveform is made, therebyamplifying the second transmission signal.

According to various embodiments, the second transmission circuitry 320may include a linear regulator (for example, a second linear regulator323) or a comparator (for example, a second comparator (notillustrated)), which is included in the ET modulator. Although nocomparator is separately illustrated in FIG. 3, the second linearregulator 323 controls the input to the switching regulator 340, and itmay be accordingly understood that the comparator may be included in thesecond linear regulator 323. The second comparator may compare an inputvoltage with a reference voltage, may detect whether the input exceedsthe reference voltage, and may output the result as a digital value (forexample, 0 or 1).

According to various embodiments, the second linear regulator 323 may beconfigured to supply a second voltage to the second amplifier 321, basedon an envelope corresponding to a second designated frequency band ofthe second transmission signal. The second linear regulator 323 mayamplify a high-frequency signal among envelope signals of an inputsignal applied to the second amplifier 321. For example, the secondlinear regulator 323 may control (or adjust) the second voltage suchthat the second voltage applied to the second amplifier 321 tracks theenvelope corresponding to the second designated frequency band. Byadjusting the second voltage to correspond to the envelope, the secondlinear regulator 323 may reduce power used by the second amplifier 321to amplify the second transmission signal. In addition, the secondlinear regulator 323 may regulate and thus compensate for noisegenerated by the switching regulator 340.

According to various embodiments, the second designated frequency bandmay be a frequency band configured in the second transmission circuitry320. The second designated frequency band may be identical to the firstdesignated frequency band or different therefrom. For example, thesecond designated frequency band may be at least one of a band of about700 MHz to about 3 GHz used for the first network 292 (for example, alegacy network), a Sub6 band (for example, about 6 GHz or lower) usedfor a second network 294 (or a 5G network), an intermediate frequencyband (for example, about 9 HHz to about 11 GHz), or a 5G Above6 band(for example, about 6 HGz to 60 GHz).

The switching regulator 340 may be electrically connected to the firstamplifier 311 and the second amplifier 321. The switching regulator 340,which adjusts (or controls) a voltage, may supply a desired voltagewhile turning a switch element (for example, a MOSFET) on or off. Theswitching regulator 340 may amplify a low-frequency signal amongenvelope signals of an input signal applied to the first amplifier 311and the second amplifier 321. The switching regulator 340 may turn theswitch element on or off under the control of the control circuitry 330.

The control circuitry 330 may be configured such that, when the firsttransmission signal is transmitted to an external electronic device (forexample, the electronic device 102 or the electronic device 104 inFIG. 1) through the first transmission circuitry 310, a third voltage issupplied to the first amplifier 311 using the switching regulator 340,based on an envelope corresponding to a third frequency band that islower than the first designated frequency band of the first transmissionsignal. The control circuitry 330 may be configured such that, when thesecond transmission signal is transmitted to the external electronicdevice through the second transmission circuitry 320, a fourth voltageis supplied to the second amplifier 321 using the switching regulator340, based on an envelope corresponding to the third frequency band thatis lower than the second designated frequency band of the secondtransmission signal. According to various embodiments, the controlcircuitry 330 may refer, for example, to a comprehensive conceptincluding a circuitry for controlling wireless communication accordingto various embodiments, such as a communication processor (for example,the processor 120, the first communication processor 212, or the secondcommunication processor 214 in FIG. 2), an RFIC (for example, the firstRFIC 222 or the second RFIC 224 in FIG. 2), a wireless communicationmodule (for example, the wireless communication module 192 in FIG. 1 orFIG. 2), or an envelope tracking digital analog convertor (ET DAC).

According to various embodiments, the control circuitry 330 may controlthe third voltage such that the output voltage of the switchingregulator 340 tracks an envelope corresponding to the third frequencyband. The control circuitry 330 may control the fourth voltage such thatthe output voltage of the switching regulator 340 tracks an envelopecorresponding to the fourth frequency band.

Although expressions such as “first” and “second” are used in FIG. 3 todistinguish the transmission circuitries (for example, the firsttransmission circuitry 310 and the second transmission circuitry 320),the amplifiers (for example, the first amplifier 311 and the secondamplifier 321), and the linear regulators (for example, the first linearregulator 313 and the second linear regulator 323), these elementsperform the same functions, and such a use of the expressions “first”and “second” is for facilitating recognition only, and does not limitthe disclosure in any manner. In another embodiment, the firsttransmission circuitry 310 and the second transmission circuitry 320 maybe configured to process signals in different frequency bands.

FIG. 4A is a diagram illustrating an example configuration of an ETmodulator according to various embodiments, FIG. 4B is a diagramillustrating an example configuration of an ET modulator according tovarious embodiments, and FIG. 4C is a diagram illustrating an exampleconfiguration of an ET modulator according to various embodiments.

Referring to FIG. 4A, the envelope tracking (ET) modulator 400 may applyan envelope signal of an input signal applied to an amplifier (forexample, the first amplifier 311 or the second amplifier 321 in FIG. 3)as a power supply voltage of the first amplifier 311 or the secondamplifier 321, thereby reducing the power consumption. Such an ETmodulator 400 may include two types of different regulators (hybridstructure) in order to have high-efficiency and high-linearitycharacteristics. For example, the ET modulator 400 may include a linearregulator 410 and/or a switching regulator 430. The ET modulator 400 mayinclude a comparator 420 configured to compare the output from thelinear regulator 410 and to control the input to the switching regulator430. The ET modulator 400 in FIG. 4A may, for example, be referred to asa “second type ET modulator”.

The linear regulator 410 (for example, the first linear regulator 311 orthe second linear regulator 321 in FIG. 3), which controls (or adjusts)a voltage, may compare an output voltage and a reference voltage andoutput a predetermined voltage. The linear regulator 410 is designed tooperate with a linear relation between input and output. The linearregulator 410 may amplify a high-frequency signal among envelope signalsof an input signal applied to the first amplifier 311 or the secondamplifier 321.

According to various embodiments, the linear regulator 410 may regulateand thus compensate for noise generated by the switching regulator 430.For example, even if a low-frequency signal from the switching regulator340 is distorted by a trace (for example, a signal line through which asignal from the switching regulator 340 is delivered), the linearregulator 410 may regulate the same and thus generate an envelopesignal. The linear regulator 410 has high-speed characteristics and thuscan track envelope signals in a wide bandwidth, but may have a lowefficiency (for example, a small amount of current output). Since thelinear regulator 410 has a high speed while the switching regulator 430has a low speed, the linear regulator 410 may operate as a master thatcontrols the switching regulator 430, and the switching regulator 430may operate as a slave.

The comparator 420 plays the role of controlling the operating relationbetween the linear regulator 410 and the switching regulator 430. If thelinear regulator 410 and the switching regulator 430 operateindependently of each other, problems such as divergence or oscillationmay occur. Accordingly, the current directionality of the linearregulator 410 is sensed through the comparator 420, and the on/off stateof the switching regulator 430 is controlled accordingly. For example,if the linear regulator 410 is SOURCING a current by the output (OUT),the switching regulator 430 operates in an on state and, when SINKING acurrent, the switching regulator 430 operates in an off state.Accordingly, the input to the comparator 420 becomes an envelope signal,and the output therefrom becomes a digital signal. Therefore, since theinput bandwidth of the comparator 420 increases in proportion to thebandwidth of the envelope signal, designing the comparator closer to thelinear regulator 410 than the switching regulator 430 is moreadvantageous to simplifying wideband signals.

The switching regulator 430 (for example, the switching regulator 340 inFIG. 3), which adjusts (or controls) a voltage, is designed to supply adesired voltage while turning a switch element (for example, a MOSFET)on or off. The switching regulator 430 may amplify a low-frequencysignal among envelope signals of an input signal applied to theamplifier (the first amplifier 311 or the second amplifier 321). Forexample, the switching regulator 430 may turn the switch element onuntil the output voltage reaches a necessary level such that power issupplied from the input to the output. If the output voltage reaches thedesired level, the switching regulator 430 may turn the switch elementoff such that input power is not consumed. For example, if the switchingregulator 430 turns the switch element on, power may be supplied to theoutput terminal (out) through an inductor 440 and, if the switch elementis turned off, power accumulated in the inductor 440 may be supplied tothe output terminal. If the switch element is turned on, the outputpower may increase and, if the switch element is turned off, the outputpower may decrease. Using this principle, the switching regulator 430may control the output power. The switching regulator 430 may output alarge amount of current (or voltage) (for example, high efficiency), buthas a low speed, and thus may have difficulty in tracking envelopesignals in a wide bandwidth.

Referring to FIG. 4B, the ET modulator 450 may be designed to includeonly the switching regulator 430. If the ET modulator 450 may beincluded in the electronic device (for example, the electronic device101 in FIG. 1), the linear regulator 410 and the comparator 420 may beincluded in the transmission circuitry (for example, the firsttransmission circuitry 310 or the second transmission circuitry 320 inFIG. 3). The ET modulator 450 in FIG. 4B may be referred to as a “firsttype ET modulator”.

Referring to FIG. 4C, the ET modulator 470 may include a linearregulator 410, a comparator 420, a switching regulator 430 and/or amultiplexer 480. The linear regulator 410 (for example, the first linearregulator 311 or the second linear regulator 321 in FIG. 3), thecomparator 420, and the switching regulator 430 (for example, theswitching regulator 340 in FIG. 3) have already been described in detailwith reference to FIG. 3 and FIG. 4A, and repeated description thereofwill not be provided here. The ET modulator 470 in FIG. 4C may bereferred to as a “third type ET modulator”.

The multiplexer 480 may be a combination circuitry configured to selectone from multiple input lines and to connect the same to a single outputline. Simply referred to as a “MUX”, the multiplexer 480 has a singleoutput in connection with multi-input data, and thus is also referred toas a data selector. If the ET modulator 470 is connected to at least twotransmission circuitry, if one transmission circuitry includes a linearregulator, and if the other transmission circuitry does not include alinear regulator, the multiplexer 480 may control signals input to theswitching regulator 430. For example, if the transmission circuitriesinclude linear regulators (for example, the first transmission circuitry310 and the second transmission circuitry 320 in FIG. 3), themultiplexer 480 may output signals (e.g, EXT_CMP) output from the linearregulators included in the transmission circuitries to the switchingregulator 430 as input signals. If the transmission circuitries includeno linear regulators, the multiplexer 480 may output signals output fromthe linear regulator 410 included in the ET modulator 470 to theswitching regulator 430 as input signals.

FIG. 5 is a diagram illustrating an example current graph of an ETmodulator according to various embodiments.

Referring to FIG. 5, the ET modulator (for example, the ET modulator 400in FIG. 4A, the ET modulator 450 in FIG. 4B, or the ET modulator 470 ofFIG. 4C) may control the switching regulator (for example, the switchingregulator 340 in FIG. 3, or the switching regulator 430 in FIG. 4A toFIG. 4C) or the linear regulator (for example, the linear regulators 313and 323 in FIG. 3 or the linear regulator 410 in FIG. 4A or FIG. 4C) soas to output an envelope signal 510. The envelope signal 510 may begenerated using a low-frequency signal 520 generated by the switchingregulator and a high-frequency signal 530 generated by the linearregulator. The ET modulator may control the envelope signal 510 appliedto the amplifier (for example, the first amplifier 311 or the secondamplifier 321 in FIG. 3) so as to reduce power consumed by theelectronic device 101.

According to various embodiments, the comparator (for example, thecomparator 420 in FIG. 4A to FIG. 4C) compares a current 530 output fromthe linear regulator (for example, the linear regulator 410 in FIG. 4Ato FIG. 4C) with a comparative reference value, thereby generating adigital signal for controlling the switching regulator (for example, theswitching regulator 340 in FIG. 3 or the switching regulator 430 in FIG.4A and FIG. 4B). The digital signal is 1 or 0:1 corresponds to a signalfor operating the switching regulator in an on state, and 0 correspondsto a signal for operating the same in an off state.

FIG. 6A is a diagram illustrating an example configuration of anelectronic device having an ET modulator applied thereto according to anexample embodiment.

Referring to FIG. 6A, the electronic device according to an example (forexample, the electronic device 101 in FIG. 1) may include acommunication processor (for example, the first communication processor212), an RFIC (for example, the RFIC 222 in FIG. 2), an ET modulator400, and a transmission circuitry 600.

The communication processor 212 may include various processing circuitryand support establishment of a communication channel in a band to beused for wireless communication with a network (for example, the secondnetwork 199 in FIG. 1), and network communication through theestablished communication channel. According to various embodiments, thenetwork may be a legacy network including, for example, and withoutlimitation, a 2G, 3G, 4G, or long term evolution (LTE) network. Thecommunication processor 212 may further include an envelope trackingdigital analog converter (ET DAC) 660.

The ET DAC 660 may include an envelope detector and a digital signalprocessor (DSP). The envelope detector may convert an in-phase(I)/quadrature-phase (Q) signal into an envelope signal. The I/Q signalmay refer, for example, to a signal having a modulated frequency, andmay be input to the linear regulator 410 as an in-phase “I” signalhaving a phase of 0° and as an orthogonal “Q” signal having a phase of90°. The digital signal processor may adjust the shaping or delay of theenvelope signal output from the envelope detector. The amplifier maygenerate a third-order inter modulation distortion (IMD3) during signalamplification, and the third-order inter modulation distortion may havea sweet spot point. The shaping may correspond to tracking the sweetspot so as to control the envelope signal. The digital signal processormay control the envelope signal such that the envelope signal tracks thetransmission signal amplified by the transmission circuitry 600.According to various embodiments, although the ET DAC 660 is illustratedin the diagram as being included in the communication processor 212, theET DAC 660 may be included in the RFIC 222.

During transmission, the RFIC 222 may convert a baseband signalgenerated by the communication processor 212 into a radio frequencysignal (for example, a frequency band of about 600 MHz to about 6 GHz)used for the network.

The ET modulator 400 may include a linear regulator 410, a comparator420, and/or a switching regulator 430. The linear regulator 410 (thefirst linear regulator 311 or the second linear regulator 321 in FIG.3), the comparator 420, and the switching regulator 430 (for example,the switching regulator 340 in FIG. 3) have already been described indetail with reference to FIG. 3 and FIG. 4A, and repeated descriptionthereof will not be provided here.

The transmission circuitry 600 may include a power amplifier (PA) 610, alow-noise amplifier (LNA) 620, a filter/duplexer 630, multiple mobileindustry processor interface (MIPI) controllers 640, and an antennaswitch (ASW) 650. The power amplifier 610 (for example, the firstamplifier 311 or the second amplifier 321 in FIG. 3) may amplify atransmission signal (e.g., PA_IN). The low-noise amplifier 620 mayamplify a reception signal. The filter/duplexer 630 may be connected tothe antenna (for example, the first antenna module 242 in FIG. 2) of theelectronic device 101 so as to separate transmission/receptionfrequencies of the electronic device 101. The filter/duplexer 630 mayinclude multiple filters or duplexers with regard to respectivefrequency bands. The multiple MIPI controllers 640 may controltransmission signals or reception signals. The antenna switch (ASW) 650may select a frequency band of signals to be transmitted/received. Theantenna switch 650 may control switches according to the frequency bandof signals to be transmitted/received.

Since the envelope signal output from the ET DAC 660 may be input to theET modulator 400, distortion of the envelope signal input to the ETmodulator 400 may become severe. The signal distortion may increase inproportion to the distance 670 (for example, the distance between the ETmodulator 400 and the transmission circuitry 600) and in proportion tothe signal bandwidth. Accordingly, the ET modulator 400 according to thecomparative example may be mounted at a small, and preferably thesmallest, distance 670 from the transmission circuitry 600. If ETtechnology is applied with regard to signals having a wide bandwidth of100 MHz or larger, as in the case of 5G, fatal distortion may occur dueto the distance 670 between the ET modulator 400 and the transmissioncircuitry 600.

FIG. 6B is a diagram illustrating an example configuration of anelectronic device having an ET modulator applied to a transmissioncircuitry according to various embodiments.

Referring to FIG. 6B, the electronic device (for example, the electronicdevice 101 in FIG. 1) according to the disclosure may include acommunication processor (for example, the first communication processor212), an RFIC (for example, the RFIC 222 in FIG. 2), an ET modulator450, and a transmission circuitry 310 (for example, the transmissioncircuitry 310 in FIG. 3).

The communication processor 212 may include various processing circuitryand support establishment of a communication channel in a band to beused for wireless communication with a network (for example, the secondnetwork 294 in FIG. 2), and network communication through theestablished communication channel. According to various embodiments, thenetwork may include, for example, and without limitation, a 2G, 3G, 4G,or long term evolution (LTE) network or a 5G network defined by thirdgeneration partnership project (3GPP).

The RFIC 222 may convert a baseband signal generated by thecommunication processor into a radio frequency signal (for example,about 6 HGz or lower) used for the network during transmission.

The ET modulator 450 may include a switching regulator 430. The ETmodulator 450 may be the first type ET modulator illustrated in FIG. 4B.The switching regulator 430 has already been described in detail withreference to FIG. 3 or FIG. 4A, and repeated description thereof willnot be repeated here.

The transmission circuitry 310 may include an amplifier 311 (forexample, the first amplifier 311 or the second amplifier 321 in FIG. 3),a linear regulator 313 (for example, the first linear regulator 313 orthe second linear regulator 323 in FIG. 3), a comparator 420 (forexample, the comparator 420 in FIG. 4A), a low-noise filter 620, afilter/duplexer 630, multiple MIPI controllers 640, an antenna switch(ASW) 650, and/or an ET DAC 660. The ET DAC 660 may convert an I/Qsignal into an envelope signal and input the same to the linearregulator 410 as an in-phase “I” signal having a phase of 0° and as anorthogonal “Q” signal having a phase of 90°. The elements of thetransmission circuitry 310 have already been described in detail withreference to FIG. 3, FIG. 4A, and FIG. 6A, and repeated descriptionthereof will not be repeated here.

According to various embodiments, since the envelope signal output fromthe ET DAC 660 included in the transmission circuitry 310 is directlyinput to the linear regulator 313 included in the transmission circuitry310, there may be little or no distortion of the envelope signal. Thesignal distortion may increase in proportion to the distance 670 (forexample, the distance between the ET modulator 440 and the transmissioncircuitry 310) and in proportion to the signal bandwidth. However, sincethe ET DAC 660 and the linear regulator 313 are included in thetransmission circuitry 310, the linear regulator 313 outputs the finalenvelope signal with regard to a signal in a wide bandwidth of about 100MHz or higher, as in the case of 5G, and there may be little or nosignal distortion depending on the distance 670.

According to various embodiments, the amplifier 311 included in thetransmission circuitry 310, the low-noise amplifier 620, thefilter/duplexer 630, the multiple MIPI controllers 640, and the antennaswitch (ASW) 650 may use, for example, a complementarymetal-oxide-semiconductor (CMOS)/silicon on insulator (SOI) waferprocess. In addition, the ET modulator including the linear regulator313, the comparator 420, and the switching regulator 430 may, forexample, also use the CMOS/SOI wafer process. Therefore, if the linearregulator 313 and the comparator 420, which are some of the elements ofthe ET modulator, are included in the transmission circuitry 310, thechip size does not change, and more efficient and cost-effective chipmanufacturing may be facilitated.

FIG. 7 is a diagram illustrating an example voltage measurement graphobtained by simulating an ET modulator according to various embodiments.

Referring to FIG. 7, the voltage measurement graph may be obtained bysimulating the output voltage of an ET modulator (for example, the ETmodulator 400 in FIG. 4A, the ET modulator 450 in FIG. 4B, or the ETmodulator 470 in FIG. 4C). If the ET modulator supports a 100 MHz bandsignal, and if the circuitry is configured such that the distancebetween the ET modulator and the transmission circuitry is, for example,about 5 cm, the first signal 710 may be an envelope input signal, thesecond signal 720 may be a conventional envelope output signal, and thethird signal 730 may be an envelope output signal according to thedisclosure. According to the prior art, a signal output to a switchingregulator (for example, the switching regulator 430 in FIG. 4A or FIG.4C) after an envelope signal is generated by a linear regulator (forexample, the linear regulator 410 in FIG. 4A or FIG. 4C) may bedistorted due to inductance resulting from the long path (for example,the distance of 5 cm). The second signal 720 fails to track the firstsignal 710 due to distortion resulting from inductance. According to thedisclosure, a linear regulator (for example, the first linear regulator313 or the second linear regulator 323 in FIG. 3) is included in atransmission circuitry (for example, the first transmission circuitry310 or the second transmission circuitry 320 in FIG. 3) such that thelinear regulator outputs the final envelope signal. Although the thirdsignal 730 has a distance of 5 cm from the wideband (for example, about100 MHz band) signal, the third signal 730 has little or no distortionresulting from inductance and thus can track the first signal 710.

FIG. 8 is a diagram illustrating an example configuration of anelectronic device including a transmission circuitry having an ETmodulator applied thereto according to various embodiments, FIG. 9 is adiagram illustrating an example configuration of an electronic deviceincluding a transmission circuitry having an ET modulator appliedthereto according to various embodiments, and FIG. 10 is a diagramillustrating an example configuration of an electronic device includinga transmission circuitry having an ET modulator applied theretoaccording to various embodiments.

According to an embodiment, an antenna capable of transmission may existinside the electronic device (for example, the electronic device 101 inFIG. 1). For example, an electronic device for 4G may normally transmitRF signals to a base station using the antenna on the bottom of theelectronic device. However, in order to increase the uplink throughput(T-put), uplink carrier aggregation (ULCA) technology is applied toelectronic devices for 4G, and evolved-universal terrestrial radioaccess-new radio (UTRA-NR) dual connectivity technology is applied toelectronic devices for 5G. In order to simultaneously transmit two ormore independent RF signals in this manner, not only the antenna on thebottom of the electronic device, but also the antenna on the top of theelectronic device need to be used. According to an embodiment, variousRF signals may be transmitted using only the antenna on the bottom, butparasitic components such as intermodulation distortion (IMD)/harmonicwaves may make it difficult to satisfy the 3GPP Spurious spec and maycause sensitivity degradation. Therefore, an ET modulator and atransmission circuitry may be arranged and configured on the top andbottom of an electronic device in various types for the purpose oftop/bottom transmission (Tx) as illustrated in FIG. 8, FIG. 9 and FIG.10.

According to various embodiments, the electronic device may beconfigured such that the ET modulator (for example, the first type ETmodulator 450 in FIG. 4B or FIG. 6B) includes only a switching regulator(for example, the switching regulator 430 in FIG. 4B or FIG. 6B), andthe transmission circuitry (for example, the transmission circuitry 310in FIG. 6B) (hereinafter, referred to as a “first type transmissioncircuitry”) includes a linear regulator (for example, the linearregulator 313 in FIG. 6B) and a comparator (for example, the comparator420 in FIG. 6B). This can compensate for not only noise generated by theswitching regulator, but also distortion resulting from trace inductanceinside the electronic device. This makes it possible to implementvarious embodiments using a minimum and/or reduced ET modulator withouta limitation on the distance between the ET modulator and thetransmission circuitry, even in a scenario in which ULCA/ENDC needs tobe supported, without having to use multiple complicated ET modulators(for example, the second type ET modulator 400 in FIG. 4A) on the topand bottom of the electronic device. In addition, using a simple ETmodulator (for example, the first type ET modulator 430) may haveadvantages in connection with the size, the mounting area, the unitprice, or circuitry arrangement (for degree of freedom of design).

In the following description with reference to FIG. 8 and FIG. 9, an ETmodulator including only a switching regulator (for example, theswitching regulator 430 in FIG. 4B or FIG. 6B) as in the case of the ETmodulator according to various embodiments (for example, the ETmodulator 450 in FIG. 4B or FIG. 6B) will be referred to as a “firsttype ET modulator”, and an ET modulator including a switching regulator(for example, the switching regulator 430 in FIG. 4A or FIG. 6A), alinear regulator (for example, the linear regulator 410 in FIG. 4A orFIG. 6A), and a comparator (for example, the comparator 420 in FIG. 4Aor FIG. 6A) as in the case of an ET modulator having an existingstructure (for example, the ET modulator 400 in FIG. 4A or FIG. 6A) willbe referred to as a “second type ET modulator”. Likewise, in thefollowing description, a transmission circuitry including a linearregulator (for example, the linear regulator 313 in FIG. 6B) and acomparator (for example, the comparator 420 in FIG. 6B) as in the caseof the transmission circuitry according to various embodiments (forexample, the transmission circuitry 310 in FIG. 6B) will be referred toas a “first type transmission circuitry”, and a transmission circuitryhaving an existing structure (for example, the transmission circuitry600 in FIG. 6A) will be referred to as a “second type transmissioncircuitry”.

FIG. 8 is a diagram illustrating the configuration of an electronicdevice according to an example embodiment. Referring to FIG. 8, theelectronic device according to the first embodiment (for example, theelectronic device 101 in FIG. 1) may include a first type transmissioncircuitry 1 810, a first type transmission circuitry 2 820, a first typeET modulator 1 830, a first type transmission circuitry 3 840, a firsttype transmission circuitry 4 850, a first type ET modulator 2 860, afirst type transmission circuitry 5 870, a first antenna module (forexample, the first antenna module 242 in FIG. 2), a second antennamodule (for example, the second antenna module 244 in FIG. 2), a thirdantenna module (for example, the third antenna module 246 in FIG. 2), afourth antenna module (for example, the fourth antenna module 248 inFIG. 2), and a fifth antenna module 880.

The first type transmission circuitry 1 810 to the first typetransmission circuitry 5 870 may be the first transmission circuitry 310or the second transmission circuitry 320 illustrated in FIG. 3 or FIG.6B. The first type transmission circuitry 1 810 to the first typetransmission circuitry 5 870 (e.g., 810, 820, 840, 850 and 870) mayinclude a linear regulator (for example, the first linear regulator 313or the second linear regulator 323) or a comparator. Each of the firsttype transmission circuitry 1 810 to the first type transmissioncircuitry 5 870 may amplify a transmission signal in a differentfrequency band or in the same frequency band. For example, the firsttype transmission circuitry 1 810 to the first type transmissioncircuitry 5 870 may be configured to process signals in differentfrequency bands.

The first type ET modulator 1 830 or the first type ET modulator 2 860may include a switching regulator (for example, the switching regulator340 in FIG. 3 or the switching regulator 430 in FIG. 4B). The first typeET modulator 1 830 or the first type ET modulator 2 860 may refer to theET modulator 450 in FIG. 4B.

The first antenna module 242 to the fifth antenna module 880 (e.g., 242,244, 246, 248, 880) may transmit a first transmission signal to a fifthtransmission signal, which have been amplified by the first typetransmission circuitry 1 810 to the first type transmission circuitry 5870, to the base station through the network.

According to various embodiments, the first type transmission circuitry1 810 and the first type transmission circuitry 2 820 may be arranged onthe top of the electronic device 101, and the first type ET modulator 2860 and the first type transmission circuitry 5 870 may be arranged onthe bottom of the electronic device 101. Since the first typetransmission circuitry 1 810 to the first type transmission circuitry 5870 include linear regulators in the disclosure, the first type ETmodulator 2 860 may be electrically connected to the first typetransmission circuitry 1 810 and the first type transmission circuitry 2820 even if the first type ET modulator 2 860 is arranged on the bottomof the electronic device 101. The first type ET modulator 2 860 may havelittle or no difficulty in providing an envelope signal even if thedistance from the first type transmission circuitry 1 810 and the firsttype transmission circuitry 2 820 increases. For example, since thefinal envelope signal is output form the linear regulators included inthe first type transmission circuitry 1 810 and the first typetransmission circuitry 2 820, little or no signal distortion may occur.

According to the prior art, one ET modulator may be necessary for everyat least two transmission circuitries because the envelope output signalfrom the ET modulator is distorted if the frequency band becomes wider,or if the distance between the ET modulator (for example, second type ETmodulator) and the transmission circuitries increases. The electronicdevice 101 according to the first embodiment can configure a circuitryusing a small number of ET modulators because the first typetransmission circuitry 1 810 to the first type transmission circuitry 5870 include linear regulators such that the envelope output signal fromthe ET modulator is not distorted even if the frequency band becomeswider, or even if the distance between the ET modulator (for example,first type ET modulator) and the transmission circuitries (for example,first type transmission circuitry) increases.

FIG. 9 is a diagram illustrating an example configuration of anelectronic device according to another example embodiment.

Referring to FIG. 9, the electronic device according to the exampleembodiment (for example, the electronic device 101 in FIG. 1) mayinclude a first type transmission circuitry 1 810, a first typetransmission circuitry 2 820, a second type ET modulator 910, a secondtype transmission circuitry 1 920, a second type transmission circuitry9 930, a first type ET modulator 830, a first type transmissioncircuitry 3 940, a first antenna module (for example, the first antennamodule 242 in FIG. 2), a second antenna module (for example, the secondantenna module 244 in FIG. 2), a third antenna module (for example, thethird antenna module 246 in FIG. 2), a fourth antenna module (forexample, the fourth antenna module 248 in FIG. 2), and a fifth antennamodule 880.

The first type transmission circuitry 1 810, the first type transmissioncircuitry 2 820, or the first type transmission circuitry 3 940 may bethe first transmission circuitry 310 or the second transmissioncircuitry 320 illustrated in FIG. 3 or FIG. 6B. The first typetransmission circuitry 1 810, the first type transmission circuitry 2820, and/or the first type transmission circuitry 3 940 may include alinear regulator (for example, the first linear regulator 313 or thesecond linear regulator 323) or a comparator. Each of the first typetransmission circuitry 1 810, the first type transmission circuitry 2820, and/or the first type transmission circuitry 3 940 may amplify atransmission signal in a different frequency band or in the samefrequency band. For example, the first type transmission circuitry 1 810to the first type transmission circuitry 3 940 may be configured toprocess signals in different frequency bands.

The second type transmission circuitry 1 920 and/or the second typetransmission circuitry 2 930 may be the transmission circuitry 600illustrated in FIG. 6A. For example, the second type transmissioncircuitry 1 920 or the second type transmission circuitry 2 930 may notinclude a linear regulator or a comparator and may include, for example,a power amplifier (PA) 610, a low-noise amplifier (LNA) 620, afilter/duplexer 630, multiple MIPI controllers 640, and an antennaswitch (ASW) 650.

The second type ET modulator 910 may include a linear regulator (forexample, the linear regulator 410 in FIG. 4A), a comparator (forexample, the comparator 420 in FIG. 4A), and a switching regulator (forexample, the switching regulator 430 in FIG. 4A). The second type ETmodulator 910 may be the ET modulator 400 illustrated in FIG. 4A.

The first type ET modulator 830 may include a switching regulator (forexample, the switching regulator 340 in FIG. 3 or the switchingregulator 430 in FIG. 4B). The first type ET modulator 830 may refer tothe ET modulator 450 in FIG. 4B.

The first antenna module 242 to the fifth antenna module 880 maytransmit a first transmission signal to a fifth transmission signal,which have been amplified by the first type transmission circuitry 1 810to the first type transmission circuitry 3 940, the second typetransmission circuitry 1 920, and the second type transmission circuitry2 930, to the base station through the network.

According to various embodiments, the first type transmission circuitry1 810 and the first type transmission circuitry 2 820 may be arranged onthe top of the electronic device 101, and the first type ET modulator830 may be arranged on the bottom of the electronic device 101. Sincethe first type transmission circuitry 1 810 and the first typetransmission circuitry 2 820 include linear regulators in thedisclosure, the first type ET modulator 830 may be electricallyconnected to the first type transmission circuitry 1 810 and the firsttype transmission circuitry 2 820 even if the first type ET modulator830 is arranged on the bottom of the electronic device 101. The firsttype ET modulator 830 may have little or no difficulty in providing anenvelope signal even if the distance from the first type transmissioncircuitry 1 810 and the first type transmission circuitry 2 820increases. For example, since the final envelope signal is output fromthe linear regulators included in the first type transmission circuitry1 810 and the first type transmission circuitry 2 820, little or nosignal distortion may occur.

According to various embodiments, the second type ET modulator 910 maybe connected to the second type transmission circuitry 1 920 and thesecond type transmission circuitry 2 930. Since the envelope signaloutput from the second type ET modulator 910 is directly transmitted tothe second type transmission circuitry 1 920 and the second typetransmission circuitry 2 930, little or no signal distortion may occur.The electronic device 101 according to the second embodiment canconfigure a circuitry using a small number of ET modulators because theenvelope output signal from the first type ET modulator 830 is notdistorted even if the frequency band becomes wider, or even if thedistance between the first type ET modulator 830 and the first typetransmission circuitry 1 810 and the first type transmission circuitry 2820 increases.

Various embodiments may be implemented using a reduced or minimum ETmodulator without a limitation on the distance between the ET modulatorand the transmission circuitry, even in a scenario in which ULCA/ENDCneeds to be supported. In addition, using a simple ET modulator (forexample, first type ET modulator) may have advantages in connection withthe size, the mounting area, the unit price, or circuitry arrangement(for degree of freedom of design).

FIG. 10 is a diagram illustrating an example configuration of anelectronic device according to another example embodiment.

Referring to FIG. 10, the electronic device according to another exampleembodiment (for example, the electronic device 101 in FIG. 1) mayinclude a first type transmission circuitry 810, a second typetransmission circuitry 1 920, a second type ET modulator 910, a secondtype transmission circuitry 2 1010, a second type transmission circuitry3 1020, a third type ET modulator 1030, a second type transmissioncircuitry 4 1040, a first antenna module (for example, the first antennamodule 242 in FIG. 2), a second antenna module (for example, the secondantenna module 244 in FIG. 2), a third antenna module (for example, thethird antenna module 246 in FIG. 2), a fourth antenna module (forexample, the fourth antenna module 248 in FIG. 2), and a fifth antennamodule 880.

The first type transmission circuitry 810 may be the first transmissioncircuitry 310 or the second transmission circuitry 320 illustrated inFIG. 3 or FIG. 6B. The first type transmission circuitry 810 may includea linear regulator (for example, the first linear regulator 313 or thesecond linear regulator 323) or a comparator.

The second type transmission circuitry 1 920, the second typetransmission circuitry 2 1010, the second type transmission circuitry 31020, or the second type transmission circuitry 4 1040 may be thetransmission circuitry 600 illustrated in FIG. 6A. For example, thesecond type transmission circuitry 1 920, the second type transmissioncircuitry 2 1010, the second type transmission circuitry 3 1020, or thesecond type transmission circuitry 4 1040 may not include a linearregulator or a comparator and may include, for example, a poweramplifier (PA) 610, a low-noise amplifier (LNA) 620, a filter/duplexer630, multiple MIPI controllers 640, and an antenna switch (ASW) 650.

The second type ET modulator 910 may include a linear regulator (forexample, the linear regulator 410 in FIG. 4A), a comparator (forexample, the comparator 420 in FIG. 4A), and a switching regulator (forexample, the switching regulator 430 in FIG. 4A). The second type ETmodulator 910 may be the ET modulator 400 illustrated in FIG. 4A.

The third type ET modulator 1030 may include a linear regulator (forexample, the linear regulator 410 in FIG. 4C), a comparator (forexample, the comparator 420 in FIG. 4C), a switching regulator (forexample, the switching regulator 430 in FIG. 4C), and a multiplexer (forexample, the multiplexer 480 in FIG. 4C). The third type ET modulator1030 may be the ET modulator 470 illustrated in FIG. 4C.

The first antenna module 242 to the fifth antenna module 880 (e.g., 242,244, 246, 248, 880) may transmit a first transmission signal to a fifthtransmission signal, which have been amplified by the first typetransmission circuitry 810 and the second type transmission circuitry 1920 to the second type transmission circuitry 4 1040, to the basestation through the network.

According to various embodiments, the first type transmission circuitry810 and the second type transmission circuitry 1 920 may be arranged onthe top of the electronic device 101, and the third type ET modulator1030 may be arranged on the bottom of the electronic device 101. Thethird type ET modulator 1030 may control signals input to switchingregulators when an envelope signal is provided to the first typetransmission circuitry 810 using the multiplexer 480, and when anenvelope signal is provided to the second type transmission circuitry 1920 and the second type transmission circuitry 4 1040.

For example, when amplifying the first transmission signal of the firsttype transmission circuitry 810 including a linear regulator, the typedtype ET modulator 1030 may output the signal output from the linearregulator included in the first type transmission circuitry 810 to theswitching regulator 430 as an input signal. When amplifying thetransmission signals of the second type transmission circuitry 1 920 andthe second type transmission circuitry 4 1040 that include no linearregulators, the third type ET modulator 1030 may output the signaloutput from the linear regulator 410 included in the third type ETmodulator 1030 to the switching regulator 430 as an input signal.

In the disclosure, the first type transmission circuitry 810 includes alinear regulator, and the third type ET modulator 1030 includes a linearregulator, a comparator, a switching regulator, and a multiplexer suchthat, even if the third type ET modulator 1030 is arranged on the bottomof the electronic device 101, the third type ET modulator 1030 may beelectrically connected to the first type transmission circuitry 810 andthe second type transmission circuitry 1 920. For example, since thefinal envelope signal is output from the linear regulator included inthe first type transmission circuitry 810 or from the linear regulatorincluded in the third type ET modulator 1030, little or no signaldistortion may occur.

According to various embodiments, the second type ET modulator 910 maybe connected to the second type transmission circuitry 2 1010 and thesecond type transmission circuitry 3 1020. Since the envelope signaloutput from the second type ET modulator 910 is directly transmitted tothe second type transmission circuitry 2 1010 and the second typetransmission circuitry 3 1020, little or no signal distortion may occur.The electronic device 101 according to this example embodiment may havea circuitry configured using a small number of ET modulators because thefinal envelope output signal is not distorted even if the frequency bandbecomes wider, or even if the distance between the third type ETmodulator 1030 and the first type transmission circuitry 810 or thesecond type transmission circuitry 1 920 increases.

As described above, an electronic device according to variousembodiments may include: a first transmission circuitry including afirst amplifier configured to amplify a first transmission signal and afirst linear regulator configured to supply a first voltage to the firstamplifier based on an envelope corresponding to a first designatedfrequency band of the first transmission signal; a second transmissioncircuitry including a second amplifier configured to amplify a secondtransmission signal and a second linear regulator configured to supply asecond voltage to the second amplifier based on an envelopecorresponding to a second designated frequency band of the secondtransmission signal; a switching regulator electrically connected to thefirst amplifier and the second amplifier; and a control circuitry. Thecontrol circuitry may be configured to, based on the first transmissionsignal being transmitted to an external electronic device through thefirst transmission circuitry, supply a third voltage to the firstamplifier using the switching regulator based on an envelopecorresponding to a third frequency band, the third frequency band beinglower than the first designated frequency band of the first transmissionsignal. In addition, the control circuitry 330 may be configured, basedon the second transmission signal being transmitted to the externalelectronic device through the second transmission circuitry, supply afourth voltage to the second amplifier using the switching regulator,based on an envelope corresponding to the third frequency band, thethird frequency band being lower than the second designated frequencyband of the second transmission signal.

According to various example embodiments, the first transmissioncircuitry may further include a first comparator configured to comparethe first voltage and the third voltage, and the second transmissioncircuitry may further include a second comparator configured to comparethe second voltage and the fourth voltage.

According to various example embodiments, the first linear regulator maybe configured to control the first voltage to track the envelopecorresponding to the first designated frequency band, and the secondlinear regulator may be configured to control the second voltage totrack the envelope corresponding to the second designated frequencyband.

According to various example embodiments, the first linear regulatorand/or the second linear regulator may be configured to regulate andthus compensate for noise generated by the switching regulator.

According to various example embodiments, the first designated frequencyband may differ from the second designated frequency band.

According to various example embodiments, the first transmissioncircuitry may further include a multiplexer, and the control circuitrymay be configured to control the multiplexer to control the voltageinput to the switching regulator.

As described above, an electronic device according to various exampleembodiments may include: a first transmission circuitry including afirst amplifier configured to amplify a first transmission signal and afirst linear regulator configured to provide a first envelope signal tothe first amplifier based on an envelope corresponding to a firstdesignated frequency band of the first transmission signal; a secondtransmission circuitry including a second amplifier configured toamplify a second transmission signal; an envelope tracking (ET)modulator comprising ET modulating circuit electrically connected to thefirst amplifier and the second amplifier; and a control circuitry. Thecontrol circuitry may be configured based on the first transmissionsignal being transmitted to an external electronic device through thefirst transmission circuitry, to provide the first envelope signal tothe first amplifier using the ET modulator. In addition, the controlcircuitry may be configured based on the second transmission signalbeing transmitted to the external electronic device through the secondtransmission circuitry, to provide a second envelope signal output fromthe ET modulator to the second amplifier.

According to various example embodiments, the ET modulator may include aswitching regulator, and the control circuitry may be configured toprovide the first envelope signal generated by a high-frequency signaloutput from the first linear regulator and a low-frequency signal outputfrom the switching regulator to the first amplifier.

According to various example embodiments, the ET modulator may include aswitching regulator and a second linear regulator, and the controlcircuitry 330 may be configured to provide the second envelope signalgenerated by a high-frequency signal output from the second linearregulator and a low-frequency signal output from the switching regulatorto the second amplifier 321.

According to various example embodiments, the ET modulator may include aswitching regulator, the second transmission circuitry may furtherinclude a second linear regulator, and the control circuitry may beconfigured to provide the second envelope signal generated by ahigh-frequency signal output from the second linear regulator and alow-frequency signal output from the switching regulator to the secondamplifier.

According to various example embodiments, the ET modulator may furtherinclude a second linear regulator, a switching regulator, and amultiplexer, and the control circuitry may be configured to control themultiplexer to control the signal input to the switching regulator.

According to various example embodiments, based on amplifying the firsttransmission signal of the first transmission circuitry, the controlcircuitry 330 may be configured to control the multiplexer to output thesignal output from the first linear regulator as an input signal to theswitching regulator.

According to various example embodiments, the ET modulator may furtherinclude a second linear regulator, and, based on amplifying the secondtransmission signal of the second transmission circuitry, the controlcircuitry may be configured to control the multiplexer to output thesignal output from the second linear regulator included in the ETmodulator as an input signal to the switching regulator.

As described above, an electronic device according to various exampleembodiments may include: a first transmission circuitry including afirst amplifier configured to amplify a first transmission signal and afirst linear regulator configured to provide a first voltage to thefirst amplifier, based on an envelope corresponding to a firstdesignated frequency band of the first transmission signal; a secondtransmission circuitry including a second amplifier configured toamplify a second transmission signal; an envelope tracking (ET)modulator comprising ET modulating circuit electrically connected to thefirst amplifier and the second amplifier, the ET modulator including asecond linear regulator configured to supply a second voltage to thesecond amplifier, based on an envelope corresponding to the seconddesignated frequency band of the second transmission signal; and acontrol circuitry. The control circuitry 330 may be configured based onthe first transmission signal being transmitted to an externalelectronic device through the first transmission circuitry, to supply athird voltage to the first amplifier using the ET modulator, based on anenvelope corresponding to a third frequency band, the third frequencyband being lower than the first designated frequency band of the firsttransmission signal. In addition, the control circuitry 330 may beconfigured based on the second transmission signal being transmitted tothe external electronic device through the second transmissioncircuitry, to supply a fourth voltage to the second amplifier using theswitching regulator, based on an envelope corresponding to the thirdfrequency band, the third frequency band being lower than the seconddesignated frequency band of the second transmission signal.

According to various example embodiments, the ET modulator may furtherinclude a switching regulator, and the control circuitry may beconfigured to supply the third voltage to the first amplifier using theswitching regulator, and the fourth voltage is supplied to the secondamplifier using the switching regulator.

According to various example embodiments, the first transmissioncircuitry may further include a first comparator configured to comparethe first voltage and the third voltage, and the ET modulator mayfurther include a second comparator configured to compare the secondvoltage and the fourth voltage.

According to various example embodiments, the ET modulator may furtherinclude a switching regulator and a multiplexer, and the controlcircuitry 330 may be configured to control the multiplexer to controlthe voltage input to the switching regulator.

According to various example embodiments, based on amplifying the firsttransmission signal of the first transmission circuitry, the controlcircuitry may be configured to control the multiplexer to output thesignal output from the first linear regulator as an input signal to theswitching regulator. In addition, based on amplifying the secondtransmission signal of the second transmission circuitry, the controlcircuitry may be configured to control the multiplexer to output thesignal output from the second linear regulator included in the ETmodulator as an input signal to the switching regulator.

According to various example embodiments, the ET modulator 450 mayfurther include a switching regulator, and the first linear regulator orthe second linear regulator may be configured to regulate and thuscompensate for noise generated by the switching regulator.

According to various example embodiments, the first designated frequencyband may differ from the second designated frequency band.

FIG. 11 is a flowchart illustrating an example method for operating anelectronic device according to various embodiments.

Referring to FIG. 11, in operation 1101, the control circuitry 330 ofthe electronic device 101 may detect a transmission signal. According toan embodiment, the control circuitry 330 may refer to a comprehensiveconcept including a circuitry for controlling wireless communicationaccording to various example embodiments, such as a communicationprocessor (for example, the processor 120, the first communicationprocessor 212, or the second communication processor 214 in FIG. 2), anRFIC (for example, the first RFIC 222 or the second RFIC 224 in FIG. 2),a wireless communication module (for example, the wireless communicationmodule 192 in FIG. 1 or FIG. 2), or an ET DAC.

According to an embodiment, the electronic device may include: a firsttransmission circuitry including a first amplifier configured to amplifya first transmission signal and a first linear regulator configured tosupply a first voltage to the first amplifier, based on an envelopecorresponding to a first designated frequency band of the firsttransmission signal; and a second transmission circuitry including asecond amplifier configured to amplify a second transmission signal anda second linear regulator configured to supply a second voltage to thesecond amplifier, based on an envelope corresponding to a seconddesignated frequency of the second transmission signal. According to anembodiment, the first designated frequency band may differ from thesecond designated frequency band. According to an embodiment, theelectronic device may include an ET modulator comprising ET modulatingcircuit electrically connected to the first amplifier and the secondamplifier. According to various embodiments, the ET modulator mayinclude a switching regulator. According to an embodiment, the firsttransmission circuitry may further include a first comparator configuredto compare the first voltage and the third voltage, and the secondtransmission circuitry may further include a second comparatorconfigured to compare the second voltage and the fourth voltage.According to an embodiment, the first linear regulator may be configuredto control the first voltage to track the envelope corresponding to thefirst designated frequency band, and may be configured to regulate andthus compensate for noise generated by the switching regulator.According to an embodiment, the second linear regulator may beconfigured to control the second voltage to track the envelopecorresponding to the second designated frequency band, and may beconfigured to regulate and thus compensate for noise generated by theswitching regulator.

In operation 1103, the control circuitry 330 may determine whether thetransmission signal corresponds to a first transmission signal or to asecond transmissions signal.

If the transmission signal is a first transmission signal in operation1103 (for example, “YES” in operation 1103), the control circuitry 330may conduct control, in operation 1105, such that the first transmissionsignal is supplied to the first amplifier 311, based on an envelopecorresponding to a frequency band that is lower than the designatedfrequency band of the first transmission signal. According to anembodiment, when the first transmission signal is transmitted to anexternal electronic device through the first transmission circuitry 310,the control circuitry 330 may conduct control such that a third voltageis supplied to the first amplifier 311 using the switching regulator 340or 430, based on an envelope corresponding to a third frequency bandthat is lower than the first designated frequency band of the firsttransmission signal.

If the transmission signal is a second transmission signal in operation1103 (for example, “NO” in operation 1103), the control circuitry 330may conduct control, in operation 1107, such that the secondtransmission signal is supplied to the second amplifier 321, based on anenvelope corresponding to a frequency band that is lower than thedesignated frequency band of the second transmission signal. Accordingto an embodiment, when the second transmission signal is transmitted toan external electronic device through the second transmission circuitry320, the control circuitry 330 may conduct control such that a fourthvoltage is supplied to the second amplifier 321 using the switchingregulator 340 or 430, based on an envelope corresponding to a thirdfrequency band that is lower than the second designated frequency bandof the second transmission signal.

According to various example embodiments, a linear regulator of an ETmodulator is included in a transmission circuitry such that ETtechnology can be applied to signals having wide bandwidths without anyand/or reduced limitation on the distance between the ET modulator andthe transmission circuitry.

According to various example embodiments, the electronic device has apower amplifier configured using a small number of ET modulators suchthat an uplink carrier aggregation (ULCA) or e-ULTRA-NR dualconnectivity (ENDC) technology can be implemented in connection with theelectronic device.

The various example embodiments of the disclosure disclosed herein andillustrated in the drawings are merely examples presented to easilydescribe technical details of the disclosure and to aid in theunderstanding of the disclosure, and are not intended to limit the scopeof the disclosure. Therefore, it should be understood that, in additionto the embodiments disclosed herein, all modifications and changes ormodified and changed forms derived from the technical idea of thedisclosure fall within the scope of the disclosure.

What is claimed is:
 1. An electronic device comprising: an antenna; aswitching regulator; communication chip including an amplifier and alinear regulator operably connected to the amplifier and the switchingregulator, the communication chip configured to transmit aradio-frequency signal through the antenna, the amplifier beingconfigured to receive an input signal, wherein the radio-frequencysignal corresponds to the input signal of the amplifier; and controlcircuitry configured to control the communication chip such that thelinear regulator provides the amplifier with a voltage corresponding toan envelope of the input signal, wherein the linear regulator and theamplifier are disposed inside the communication chip, and the switchingregulator is disposed outside the communication chip.
 2. The electronicdevice of claim 1, wherein the control circuitry includes an envelopetracking digital-analog converter (ET DAC), and the ET DAC is disposedinside the communication chip.
 3. The electronic device of claim 1,wherein the switching regulator is a first switching regulator, thecommunication chip is first communication chip, the amplifier is a firstamplifier, and the linear regulator is a first linear regulator, whereinthe electronic device further comprises: an envelope tracking (ET)modulator including a second switching regulator and a second linearregulator; and second communication chip operably connected to the ETmodulator and including a second amplifier.
 4. The electronic device ofclaim 1, wherein the communication chip is first communication chip, theamplifier is a first amplifier, and the linear regulator is a firstlinear regulator, wherein the electronic device further comprises secondcommunication chip including a second amplifier and a second linearregulator, and the switching regulator is operably connected to thesecond communication chip.
 5. The electronic device of claim 4, whereinthe first communication chip is arranged closer to a lower end of theelectronic device than an upper end of the electronic device, the secondcommunication chip is arranged closer to the upper end of the electronicdevice than the lower end of the electronic device, and the switchingregulator is arranged such that an electric path between the switchingregulator and the second communication chip is longer than an electricpath between the switching regulator and the first communication chip.6. The electronic device of claim 1, wherein the amplifier is a firstamplifier, wherein the communication chip further comprises a secondamplifier.
 7. The electronic device of claim 6, wherein the secondamplifier is configured to amplify a radio-frequency signal receivedthrough the antenna.
 8. The electronic device of claim 6, wherein thefirst amplifier is a power amplifier, and the second amplifier is alow-noise amplifier.
 9. The electronic device of claim 1, wherein thecontrol circuitry includes an envelope tracking digital-analog converter(ET DAC) configured to adjust the envelope to track the radio-frequencysignal to be transmitted through the antenna.
 10. The electronic deviceof claim 1, wherein the switching regulator and the communication chipare arranged such that an electric path between the switching regulatorand the linear regulator included in the communication chip is longerthan an electric path between the linear regulator and the amplifier.11. The electronic device of claim 1, wherein the control circuitry isincluded in the communication chip, and the switching regulator and thecommunication chip are arranged such that an electric path between theswitching regulator and the linear regulator included in thecommunication chip is longer than an electric path between the controlcircuitry and the linear regulator.
 12. A communication chip formounting on a circuit board of an electronic device to amplify aradio-frequency signal to be transmitted or received through an antennaof the electronic device, the communication chip comprising: anamplifier configured to receive an input signal, wherein aradio-frequency signal to be transmitted through the antenna correspondsto the input signal of the amplifier; and a linear regulator configuredto control a switching regulator of the electronic device to provide theamplifier with a voltage corresponding to an envelope of the inputsignal, wherein the linear regulator and the amplifier are disposedinside the communication chip, and the switching regulator is disposedoutside the communication chip.
 13. The communication chip of claim 12,wherein when the communication chip is mounted on the circuit board ofthe electronic device, a first electric path between the amplifier andthe linear regulator is shorter than a second electric path between theswitching regulator and the linear regulator.
 14. The communication chipof claim 13, wherein the second electric path is longer than a thirdelectric path between an envelope tracking digital-analog converter (ETDAC) and the linear regulator.
 15. The communication chip of claim 12,further comprising a low-noise amplifier, wherein the low-noiseamplifier is configured to amplify a radio-frequency signal receivedthrough the antenna, and the amplifier is configured to amplify aradio-frequency signal to be transmitted through the antenna.
 16. Thecommunication chip of claim 12, further comprising an envelope trackingdigital-analog converter (ET DAC) operably connected to the linearregulator, the ET DAC configured to control the linear regulator toprovide the amplifier with a voltage corresponding to an envelope of aninput signal input to the amplifier, the input signal corresponding tothe radio-frequency signal to be transmitted through the antenna. 17.The communication chip of claim 12, wherein the linear regulator isconfigured to adjust a voltage corresponding to the envelope of theinput signal to track the envelope.
 18. The communication chip of claim12, wherein the linear regulator is configured to regulate a signaloutput from the switching regulator such that a voltage corresponding tothe envelope is output.
 19. An electronic device comprising: an antenna;a switching regulator; an amplifier operably connected to the switchingregulator, and configured to receive an input signal, wherein aradio-frequency signal to be transmitted through the antenna correspondsto the input signal of the amplifier; a linear regulator operablyconnected to the switching regulator and the amplifier; and an envelopetracking digital-analog converter (ET DAC) configured to control thelinear regulator to provide the amplifier with a voltage correspondingto an envelope of the input signal, wherein an entire electric pathcoupled between the linear regulator and the amplifier is disposedwithin a communication chip, and wherein a portion of electric pathcoupled between the switching regulator and the linear regulator isdisposed between the communication chip and a separate electroniccomponent containing the switching regulator.